High power applications can affect microwave assembly construction and performance in several ways.
For spaceflight applications with power levels over 5-10 watts and frequencies between 400 MHz and 6 GHz, you must consider multipaction and ionization breakdown effects. An overview of these effects is available upon request. The second consideration is thermal breakdown. As a rough guide, you should analyze thermal breakdown for applications with a service temperature below 70° and f >3.6 GHz:
The exact power rating of each cable and connector configuration depends on its thermal environment. Please SSI for further information.
For non-spaceflight applications with very low pressure applications, such as vacuum chambers, multipaction and corona breakdown effects must be considered. An overview of these effects is available by request. The second consideration is thermal breakdown. As a rough guide for non-vacuum applications with a service temperature below 70 °C, thermal breakdown should be analyzed when: